New generation of Intel Pentium III processors with Coppermine core featured not only better manufacturing technology (0.18 micron as opposed to 0.25 micron for Katmai core), but also different cache architecture and new package type. Smaller size of the new core allowed Intel to put level 2 cache on the the same die as the core. While new cache was two times smaller than the L2 cache on Katmai processors, it was twice as fast and had a few additional performance improvements. Because external cache chips were no longer required for the new core, it became possible to put the core on smaller and cheaper Flip-Chip Ping Grid Array package.
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